Lam research corp

Complexity excites us. Collaboration drives us. At Lam, we relentlessly pursue innovation that pushes the boundaries of technical limitations, creating solutions that enable chipmakers to power lam research corp. Making semiconductors is a highly complex and iterative process.

Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. The company also builds equipment for back-end wafer-level packaging WLP and for related manufacturing markets such as for microelectromechanical systems MEMS. Lam Research was founded in by David K. Lam and is headquartered in Fremont, California. In , the company introduced its first product, the AutoEtch , an automated polysilicon plasma etcher.

Lam research corp

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For a list of our offices worldwide, please visit our Locations and Offices section. For Careers at Lam Research, please click here. For information or to submit comments about this website, please email us. Skip to content. Contact Us. About About Us Company Overview. Mission, Guiding Principles, Core Values.

Lam research corp

Meeting the ever-changing fabrication demands of new chip designs requires precision control at the atomic scale. Our broad portfolio of market-leading products for thin film deposition, plasma etch, photoresist strip, and wafer cleaning are complementary processing steps used throughout semiconductor manufacturing. To support advanced process monitoring and control of critical steps, our product offerings include a line of high-precision mass metrology systems. Deposition processes create layers of dielectric insulating and metal conducting materials used to build a semiconductor device. Depending on the type of material and structure being made, different techniques are employed. Metal plating of copper and other metals is also used for through-silicon vias and wafer-level packaging applications. Tiny tungsten connectors and thin barriers are made with the precision of chemical vapor deposition CVD and atomic layer deposition ALD , which adds only a few layers of atoms at a time. For the numerous materials and demanding features involved, our thin film deposition products provide the precision, performance, and flexibility needed for a wide range of challenging device applications. Etch processes help create chip features by selectively removing films and materials that have been deposited on the wafer. These processes involve fabricating increasingly small and complex features with complicated combinations of materials that need to be removed.

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Environmental, Social, and Governance Overview. Retrieved 6 May Job Title or Keyword. Events Stay up-to-date with our activities. Investor Resources Stockholder Services. Los Angeles Times. Dividend History. Major semiconductor companies. Archived from the original on 15 July Retrieved 19 May Careers Overview. New York. Complexity excites us.

One to share our bold spirit and restless ambition. For decades, Lam Research has been challenging assumptions and defying conventions. Pushing the boundaries of technical limitations.

At Lam, we relentlessly pursue innovation that pushes the boundaries of technical limitations, creating solutions that enable chipmakers to power progress. The company's software reportedly would allow Lam to reduce the time to market for its new chips. Media Contacts. Products Overview. Company History. Investors Investor Relations Overview Overview. Major semiconductor companies. Recruiting Events. Lam's thin film deposition systems lay down the sub-microscopic layers of conducting metal or insulating dielectric materials that make up an integrated circuit. Retrieved 16 November